Symbion P36 Plus Solder paste inspection

Benefit/Highlights:

• Superior POP™ Detection Technology
• Ultra Fast Inspection Speed
• Easy Wizard & Go™ Operation
• Closed Loop Feedback with

Symbion P36 Plus provides superior volumetric solder paste inspection and measurement, enabling real-time control of the solder paste process to minimize your costs and maximize your yields.

Ultra Fast Inspection Speed
 

The system is enhanced with streamlined architecture and powerful detection techniques for high throughput.
It requires very little user interaction and has no need for constant attention, giving you maximum productivity.
POP’s optimized image acquisition and “on-the-fly” image processing quickly inspect the entire board. Wizard & Go makes programming and setup fast and efficient. With a scan speed of up to 60 cm²/sec., Symbion P36 Plus keeps pace with your line speed today and is ready for when your throughput requirements increase. Unlike other paste inspection solutions that have to compromise on either speed or resolution, Symbion P36 Plus’ patented POP technology employs a revolutionary approach to inspection that achieves the very highest resolution at or above line speed. POP utilizes an optimized scanning technique with two scan lines operating simultaneously via independent optical channels for 3-D and 2-D image acquisition. This enables 100% full board coverage and precise measurements of solder paste deposit volume, area, shape, and location.
Orbotech’s unique 3-D laser triangulation method provides a clear, angled view for solder paste height mapping at the fine resolution of 5 μm. A true 2-D laser illumination channel ensures excellent top views of the solder paste at 20 x 20 μm resolution. The result is an exceptionally quick and complete picture of each solder paste deposit with virtually no false calls.
Powerful image processing algorithms and techniques ensure highly accurate measurement, detection and classification.