SMT

Simple-to-advanced Fluid Dispensing applications for PC Board, Hybrid, & High Density Interconnect, Adhesives, Glob-top, Underfill, Solder Paste, Solder Mask, and Potting.

Recommended: MiniMax, MicroMax, MicroCell, DS9000, or DS9100.

Semiconductor
Micro Electronics

Simple-to-advanced fluid dispensing applications for BGA (for example, FCBGA and PBGA), micro BGA, COB, Flip Chip, SiPs, and other CSP applications. Encapsulants, Underfill, Conductive Epoxies, Non-conductive Epoxies, Lid Attach, Back-end Packaging, and Heat Dissipater Attach.

Recommended: MiniMax, MicroMax, MiniMax II, MicroMax II, Micro I, or Micro II.

Table Top

Low cost, low volume production, table top system with an innovative, human programming interface. Large board capability. Single valve capacity.

Recommended: T-Max.

Precision Lead Formers

GPD Global Axial and Radial lead formers have been industry standards since the 1980s, consistently outperforming and outliving the competition.

The CF-8 for Axial components and the CF-9 for taped Radial components are capable of forming a variety of forms including flushmount, standoff, and lock-in (dependent on inserted dies). The CF-10 handles 2- to 7-leaded Radial components in bulk or loose form and is capable of a variety of forms including flushmount, standoff, lock-in, and spread forms.